화학공학소재연구정보센터
학회 한국공업화학회
학술대회 2019년 봄 (05/01 ~ 05/03, 부산 벡스코(BEXCO))
권호 23권 1호
발표분야 고분자_포스터
제목 Thermal conductivity and thermal-physical properties of nanodiamond-attached boron nitride/epoxy nanocomposites for microelectronics
초록 This research focused on evaluating the thermal and physical properties of a composite reinforced with nanodiamonds and epitaxial boron nitride in an epoxy matrix. The morphology and structure of boron nitride (BN), exfoliated hexagonal BN nanoplates (EBN), and nanodiamond-attached EBN nanoplates (NDEBN) were determined. Epoxy composites were fabricated by in-situ polymerization and reinforced with various concentrations of either EBN or NDEBN nanoplates. These composites exhibited high thermal stability and high thermal conductivity, attributed to the exceptional thermal stability and thermal conductivity inherent in nanodiamond materials. In addition, inserting nanodiamond particles between BN layers prevented the BN nanosheet from forming agglomerates. We also found that nanodiamond particles improved dynamic mechanical properties by acting as a crack pinning role, which could restrict the molecular mobility of the epoxy.
저자 Zhang Yinhang, 박수진
소속 인하대
키워드 thermal conductivity; epoxy; boron nitride
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