| 학회 |
한국재료학회 |
| 학술대회 |
2013년 봄 (05/23 ~ 05/24, 여수 엠블호텔(THE MVL)) |
| 권호 |
19권 1호 |
| 발표분야 |
E. 구조 재료(Structural Materials) |
| 제목 |
Joining W-25Re to SiC substrate by diffusion bonding process using Ti interlayer |
| 초록 |
Rhenium is a refractory metal with its high melting point and has a unique combination of physical and chemical properties. Rhenium coatings are applied to enhance heat resistance and endurance of components and also to protect them from corrosion, which makes it an ideal material for application in various fields such as high temperature structural materials, heat exchanger, and heat protector for space shuttle and missile thrusting systems. In this study, W-25Re is successfully bonded to SiC substrate with Ti interlayer by spark plasma sintering process. Ti interlayer has diffused into SiC substrate to form carbide intermediate phases to enhance bonding strength and also the layer brazed with W-25Re metal. The mechanical properties such as bonding strength have characterized and analyzed with the microstructure of the interfaces. |
| 저자 |
Dong Seok Kim1, Do Kyung Kim2
|
| 소속 |
1Department of Materials Science and Engineering, 2KAIST |
| 키워드 |
Rhenium; Diffusion bonding
|
| E-Mail |
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